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LMZ14203EXT
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SNVS666F – JUNE 2010 – REVISED OCTOBER 2013
Power Module SMT Guidelines
The recommendations below are for a standard module surface mount assembly
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Land Pattern – Follow the PCB land pattern with either soldermask defined or non-soldermask defined pads
Stencil Aperture
– For the exposed die attach pad (DAP), adjust the stencil for approximately 80% coverage of the PCB land
pattern
– For all other I/O pads use a 1:1 ratio between the aperture and the land pattern recommendation
Solder Paste – Use a standard SAC Alloy such as SAC 305, type 3 or higher
Stencil Thickness – 0.125 to 0.15mm
Reflow - Refer to solder paste supplier recommendation and optimized per board size and density
Maximum number of reflows allowed is one
Figure 33. Sample Reflow Profile
Table 1.
Probe
#1
#2
#3
Max Temp
(°C)
242.5
242.5
241.0
Reached
Max Temp
6.58
7.10
7.09
Time Above
235°C
0.49
0.55
0.42
Reached
235°C
6.39
6.31
6.44
Time Above
245°C
0.00
0.00
0.00
Reached
245°C
–
7.10
–
Time Above
260°C
0.00
0.00
0.00
Reached
260°C
–
–
–
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